Hwatsing Technology华海清科
Chemical mechanical planarization (CMP) equipment maker, also offering wafer thinning and refurbishment services.
Source: company website · checked
Profile checked www.hwatsing.com
- Listing
- 688120.SSSSE STAR
- Headquarters
- TianjinMainland China
- Segment peers
- 17cos.Equipment
- Next report
- —No confirmed date
- Export controls
- Entity Listsince 2024
Position in the supply chain
Equipment · 17 companies
Design tools · 3
Equipment & materials · 26
Chipmakers · 30
Chip designers · 20
Packaging & test · 4
ChipCorridor classification: one segment per company. Wafer-fab and back-end equipment: etch, deposition, lithography, cleaning, CMP, metrology, test.
Equipment: all 17
■ = on the US Entity List
- NAURA Technology GroupCN
- AMECCN
- PiotechCN
- ACM Research, Inc.US
- Hwatsing TechnologyCN
- KingsemiCN
- Skyverse TechnologyCN
- Beijing E-Town Semiconductor TechnologyCN
- SMEECN
- Beijing AccoTEST TechnologyCN
- Hangzhou Changchuan TechnologyCN
- Wuhan Jingce Electronic GroupCN
- PNC Process SystemsCN
- Tokyo ElectronJP
- AdvantestJP
- DISCO CorporationJP
- LasertecJP
Events
export controls, listings, earnings
Export controls
US Entity List / VEU, as of 2026-10-18
- Entity List ·
Listed as: Hwa Tsing Technology Co., Ltd. and Hwa Tsing entities
Rule details
Key facts
- Full name
- Hwatsing Technology 华海清科
- Listing(s)
- Headquarters
- Tianjin天津 Source: hwatsing.com · checked
- Segment
- Equipment (ChipCorridor classification)
- Website
- www.hwatsing.com
Profile last checked (UTC+8). Content last changed .