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Timeline · 19 actions · checked 18 Oct 2026

US & China chip export controls timeline

Dated US Bureau of Industry and Security (BIS) rules and Chinese Ministry of Commerce (MOFCOM) measures that affect semiconductors, 2019–2026. Each entry cites the Federal Register document or official notice. See also the Entity List table for Chinese chip companies.

Actions per year

Click a year to jump. Counts are actions in this dataset, not every BIS/MOFCOM notice.

US actions
15BIS
China actions
4MOFCOM / GAC / MOST
Entity List rows (chip cos.)
22table →
Tracked companies named
22

Named most often

Latest: China tech-export catalogue draft ·

Who
Type
Showing 19 of 19

Dates are when the measure was signed or released; Federal Register publication and effective dates are on each event page. Each status was last checked on the date shown under the entry.

  1. 2026

    2 events
  2. Fri
    China measureCN · MOFCOM / MOST

    China drafts export controls on AI, chip-design and solar technologies

    MOFCOM & MOST Announcement 2026 No. 48Draft for commentStatus: Draft; interim registration in effect

    Proposes adding 40 technologies (23 AI, 5 biomedicine, 12 solar) to China's catalogue of prohibited and restricted technology exports.

    Source: MOFCOM · checked

  3. Thu
    RuleUS · BIS

    Case-by-case licensing for Nvidia H200-class chips to China

    91 FR 1684Final ruleStatus: In force (as published)

    Changes the licence review policy for certain chips to China and Macau from presumption of denial to case-by-case.

    Source: Federal Register · checked

  4. 2025

    7 events
  5. Mon
    RuleUS · BIS

    One-year suspension of the Affiliates rule

    90 FR 50857Final ruleStatus: Suspension scheduled to end 2026-11-09 (no extension found as of check date)

    Suspends the September 2025 Affiliates (50 percent) rule for one year.

    Source: Federal Register · checked

  6. Fri
    China measureCN · MOFCOM / GAC

    China suspends October 2025 export-control announcements until Nov 2026

    MOFCOM & GAC Announcement 2025 No. 70Status: Suspension in effect until 2026-11-10

    Suspends MOFCOM/GAC Announcements 2025 Nos. 55–58 and MOFCOM Announcements 2025 Nos. 61 and 62 (including the extraterritorial rare-earth item controls in No. 61).

    Source: MOFCOM · checked

  7. Mon
    RuleUS · BIS

    Affiliates (50 percent) rule

    90 FR 47201Interim final ruleStatus: Suspended until 2026-11-09 by 90 FR 50857

    Any entity at least 50% owned by one or more Entity List parties automatically becomes subject to Entity List restrictions.

    Source: Federal Register · checked

  8. Fri
    Entity ListUS · BIS

    32 Entity List additions, incl. firms that sourced tools for SMIC

    90 FR 44496Final rule (Entity List)Status: In force (as listed)

    BIS added 32 entities, 23 of them under China.

    SMIC

    Source: Federal Register · checked

  9. Tue
    VEUUS · BIS

    VEU authorizations revoked for Samsung, SK hynix and Intel China fabs

    90 FR 42321Final rule (VEU)Status: Effective 2025-12-31 (later changes not tracked here)

    Removed Intel Semiconductor (Dalian), Samsung China Semiconductor and SK hynix Semiconductor (China) from the Validated End-User list for China.

    Samsung ElectronicsSK hynix

    Source: Federal Register · checked

  10. Thu
    RuleUS · BIS

    Due-diligence rule for foundries and OSATs (advanced computing ICs)

    90 FR 5298Interim final ruleStatus: In force (as published)

    Added due-diligence procedures for foundries and OSAT companies handling advanced computing ICs.

    Source: Federal Register · checked

  11. Mon
    RuleUS · BIS

    Framework for Artificial Intelligence Diffusion

    90 FR 4544Interim final ruleStatus: Rescission announced by BIS on 13 May 2025 (guidance cited in 91 FR 43034); no separate FR rescission rule found in our search

    Revised controls on advanced computing ICs and added a new control on certain closed-weight AI model weights.

    Source: Federal Register · checked

  12. 2024

    3 events
  13. Tue
    China measureCN · MOFCOM

    China tightens dual-use exports to the US (gallium, germanium, antimony, superhard materials)

    MOFCOM Announcement 2024 No. 46Status: Clause 1 in force; clause 2 suspended until 2026-11-27

    Bans exports of dual-use items to US military users or military end uses.

    Source: MOFCOM · checked

  14. Mon
    RuleUS · BIS

    December 2024 rule: new SME controls, FDP rules and HBM controls

    89 FR 96790Interim final ruleStatus: In force; comment period extended to 14 Mar 2025 by 90 FR 5298

    New controls on certain semiconductor manufacturing equipment and related items.

    Source: Federal Register · checked

  15. Mon
    Entity ListUS · BIS

    140 Entity List additions focused on chip equipment and fabs

    89 FR 96830Final rule (Entity List, VEU)Status: In force (as listed)

    BIS added 140 entities under China, Japan, South Korea and Singapore and revised 14 China entries.

    NAURA Technology GroupPiotechACM Research, Inc.Hwatsing TechnologyKingsemiSkyverse TechnologyBeijing E-Town Semiconductor TechnologyEmpyrean TechnologyPNC Process SystemsWuhan Jingce Electronic GroupJiangsu Nata Opto-electronic MaterialAMECHua Hong Grace Semiconductor

    Source: Federal Register · checked

  16. 2023

    3 events
  17. Tue
    RuleUS · BIS

    October 2023 update to advanced computing and SME controls

    88 FR 73424; 88 FR 73458Two interim final rulesStatus: Amended by later rules

    One IFR revised the semiconductor manufacturing equipment controls from the October 2022 rule.

    Source: Federal Register · checked

  18. Tue
    Entity ListUS · BIS

    Biren and Moore Threads added to the Entity List

    88 FR 71991Final rule (Entity List)Status: In force (as listed)

    BIS added 13 entities under China to the Entity List.

    Biren TechnologyMoore Threads

    Source: Federal Register · checked

  19. Mon
    China measureCN · MOFCOM / GAC

    China imposes export licensing on gallium and germanium items

    MOFCOM & GAC Announcement 2023 No. 23Status: In force (see also Announcement 2024 No. 46 for the US-specific measure)

    Export of listed gallium items (metal, nitride, oxide, phosphide, arsenide and others) and germanium items (metal, zone-refined ingots, dioxide, tetrachloride and others) requires a dual-use export licence.

    Source: MOFCOM · checked

  20. 2022

    2 events
  21. Fri
    Entity ListUS · BIS

    YMTC, Cambricon and SMEE added to the Entity List

    87 FR 77505Final rule (Entity List)Status: In force (as listed)

    BIS added 36 entities under China and Japan to the Entity List.

    YMTCCambricon TechnologiesSMEE

    Source: Federal Register · checked

  22. Fri
    RuleUS · BIS

    Advanced computing and semiconductor manufacturing controls (October 2022 rule)

    87 FR 62186Interim final ruleStatus: Amended by the October 2023 and December 2024 rules

    New controls on advanced computing ICs, computers containing them, and certain semiconductor manufacturing items.

    Source: Federal Register · checked

  23. 2020

    1 events
  24. Fri
    Entity ListUS · BIS

    SMIC and subsidiaries added to the Entity List

    85 FR 83416Final rule (Entity List)Status: In force (as listed)

    BIS added 77 entities under 78 entries to the Entity List across ten destinations.

    SMIC

    Source: Federal Register · checked

  25. 2019

    1 events
  26. Thu
    Entity ListUS · BIS

    Huawei added to the Entity List

    84 FR 22961Final rule (Entity List)Status: In force (as listed; later amendments not tracked here)

    BIS added Huawei Technologies Co., Ltd. to the Entity List under the destination of China.

    HiSilicon

    Source: Federal Register · checked

Sources: Federal Register, BIS, MOFCOM. Informational only, not legal advice. Terms such as Entity List, VEU and presumption of denial are explained in the glossary.