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Supply-chain segment

Equipment companies in China & Asia

Wafer-fab and back-end equipment: etch, deposition, lithography, cleaning, CMP, metrology, test.

CompanyListing(s)RegionProducts (sourced)
002371.SZ
Mainland ChinaChina's largest wafer-fab equipment maker by revenue: etch, deposition (PVD/CVD/ALD), thermal, cleaning tools and electronic components.
AMEC
中微公司
688012.SS
Mainland ChinaPlasma etch (CCP and ICP) and MOCVD equipment maker, expanding into thin-film deposition.
Piotech
拓荆科技
688072.SS
Mainland ChinaThin-film deposition equipment maker (PECVD, ALD, SACVD, HDPCVD) and hybrid bonding tools.
ACM Research, Inc.
ACM Research, Inc.
ACMR
United StatesNasdaq-listed maker of wet-processing equipment for chip manufacturing and wafer-level packaging, with a focus on wafer cleaning. It runs most product development and manufacturing in mainland China through its STAR-listed subsidiary ACM Research (Shanghai).
688120.SS
Mainland ChinaChemical mechanical planarization (CMP) equipment maker, also offering wafer thinning and refurbishment services.
Kingsemi
芯源微
688037.SS
Mainland ChinaCoater/developer track and single-wafer wet-cleaning equipment for front-end and advanced packaging.
688361.SS
Mainland ChinaProcess control equipment: optical inspection and metrology tools for wafer fabs.
688729.SS
Mainland ChinaDry strip, rapid thermal processing (RTP) and etch equipment; owns Mattson Technology.
SMEE
上海微电子
Not listedMainland ChinaLithography system developer (front-end scanners, advanced-packaging and LED/flat-panel steppers).
688200.SS
Mainland ChinaAutomatic test equipment (ATE) for analog, mixed-signal and power semiconductors.
300604.SZ
Mainland ChinaBack-end test equipment: testers, handlers, probers and automated optical inspection.
300567.SZ
Mainland ChinaTest and measurement equipment for displays and, via subsidiaries, semiconductor metrology and inspection.
603690.SS
Mainland ChinaHigh-purity process systems (gas and chemical delivery) and wet-cleaning equipment for fabs.
Tokyo Electron
东京电子
8035.T
JapanWafer-fab equipment maker: coater/developers, etch, deposition, cleaning and wafer probers.
Advantest
爱德万测试
6857.T
JapanAutomatic test equipment (ATE) for SoC and memory chips, plus test handlers and services.
6146.T
JapanDicing saws, laser saws and grinders for wafer thinning and singulation, plus consumable blades.
Lasertec
Lasertec
6920.T
JapanInspection systems for EUV photomasks and mask blanks, and other semiconductor inspection tools.