Supply chain · as of 18 Oct 2026
China semiconductor supply chain by segment
Each company is placed in one primary segment (our classification). Supplier and customer relationships are not mapped yet.
Foundry 8
Contract wafer manufacturing (and IDMs that also run foundry lines).
Memory 14
DRAM, HBM, NAND/NOR flash, memory interface chips and storage products.
Compute (CPU / GPU / AI) 9
CPUs, GPUs, AI accelerators and automotive AI SoCs.
Fabless SoC & RF 11
Application processors, connectivity, RF front-end, sensors and security chips.
Analog & Power 8
Analog/mixed-signal ICs, power discretes (IGBT, MOSFET, SiC) and MCUs.
Equipment 17
Wafer-fab and back-end equipment: etch, deposition, lithography, cleaning, CMP, metrology, test.
Materials 9
Silicon wafers, CMP slurries/pads, photoresists, gases, targets and precursors.
EDA & IP 3
Chip design software and licensable IP.
Packaging & Test (OSAT) 4
Outsourced assembly and test, including advanced packaging.