AMEC中微公司
Plasma etch (CCP and ICP) and MOCVD equipment maker, expanding into thin-film deposition.
Source: company website · checked
Profile checked www.amec-inc.com
- Listing
- 688012.SSSSE STAR
- Headquarters
- ShanghaiMainland China
- Segment peers
- 17cos.Equipment
- Next report
- —No confirmed date
- Export controls
- VEU change2019–2026
Position in the supply chain
Equipment · 17 companies
Design tools · 3
Equipment & materials · 26
Chipmakers · 30
Chip designers · 20
Packaging & test · 4
ChipCorridor classification: one segment per company. Wafer-fab and back-end equipment: etch, deposition, lithography, cleaning, CMP, metrology, test.
Equipment: all 17
■ = on the US Entity List
- NAURA Technology GroupCN
- AMECCN
- PiotechCN
- ACM Research, Inc.US
- Hwatsing TechnologyCN
- KingsemiCN
- Skyverse TechnologyCN
- Beijing E-Town Semiconductor TechnologyCN
- SMEECN
- Beijing AccoTEST TechnologyCN
- Hangzhou Changchuan TechnologyCN
- Wuhan Jingce Electronic GroupCN
- PNC Process SystemsCN
- Tokyo ElectronJP
- AdvantestJP
- DISCO CorporationJP
- LasertecJP
Events
export controls, listings, earnings
Export controls
US Entity List / VEU, as of 2026-10-18
- Removed from VEU program (at AMEC's request, per rule) ·
Listed as: Advanced Micro-Fabrication Equipment, Inc., China (AMEC)
Rule details
Key facts
- Full name
- AMEC (Advanced Micro-Fabrication Equipment) 中微公司
- Listing(s)
- Headquarters
- Shanghai上海 Source: amec-inc.com · checked
- Segment
- Equipment (ChipCorridor classification)
- Website
- www.amec-inc.com
Profile last checked (UTC+8). Content last changed .