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Supply-chain segment

Packaging & Test (OSAT) companies in China & Asia

Outsourced assembly and test, including advanced packaging.

CompanyListing(s)RegionProducts (sourced)
JCET Group
长电科技
600584.SS
Mainland ChinaOutsourced semiconductor assembly and test (OSAT) with wafer-level, 2.5D/3D and system-in-package capabilities.
Tongfu Microelectronics
通富微电
002156.SZ
Mainland ChinaOSAT provider with advanced packaging for CPUs/GPUs, including a long-running partnership with AMD.
Tianshui Huatian Technology
华天科技
002185.SZ
Mainland ChinaOSAT offering leadframe, substrate, bumping, wafer-level and SiP packaging and test.
ASE Technology Holding
日月光投控
3711.TW
ASX
TaiwanThe world's largest OSAT group (ASE, SPIL) plus electronic manufacturing services (USI).