DISCO Corporation
Dicing saws, laser saws and grinders for wafer thinning and singulation, plus consumable blades.
Source: company website · checked
Profile checked www.disco.co.jp/eg
- Listing
- 6146.TTSE
- Headquarters
- TokyoJapan
- Segment peers
- 17cos.Equipment
- Next report
- —No confirmed date
- Export controls
- None tracked2019–2026
Position in the supply chain
Equipment · 17 companies
Design tools · 3
Equipment & materials · 26
Chipmakers · 30
Chip designers · 20
Packaging & test · 4
ChipCorridor classification: one segment per company. Wafer-fab and back-end equipment: etch, deposition, lithography, cleaning, CMP, metrology, test.
Equipment: all 17
■ = on the US Entity List
- NAURA Technology GroupCN
- AMECCN
- PiotechCN
- ACM Research, Inc.US
- Hwatsing TechnologyCN
- KingsemiCN
- Skyverse TechnologyCN
- Beijing E-Town Semiconductor TechnologyCN
- SMEECN
- Beijing AccoTEST TechnologyCN
- Hangzhou Changchuan TechnologyCN
- Wuhan Jingce Electronic GroupCN
- PNC Process SystemsCN
- Tokyo ElectronJP
- AdvantestJP
- DISCO CorporationJP
- LasertecJP
Events
export controls, listings, earnings
No dated events in our dataset yet.
Export controls
US Entity List / VEU, as of 2026-10-18
No US Entity List or VEU action naming this company in our dataset as of 2026-10-18. Our dataset is not a complete legal screening; check the official BIS lists.
Key facts
- Full name
- DISCO Corporation
- Listing(s)
- Headquarters
- Tokyo东京 Source: disco.co.jp · checked
- Segment
- Equipment (ChipCorridor classification)
- Website
- www.disco.co.jp/eg
Profile last checked (UTC+8). Content last changed .