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Data as of (UTC+8)No stock prices · Not investment adviceEvery fact links to its source · unconfirmed items say To verify

HiSilicon海思

Not listed To verify Compute (CPU / GPU / AI) Shenzhen, Mainland China

Huawei's chip design arm: Kirin mobile SoCs and chips for connectivity, video and smart devices. Huawei's Ascend AI and Kunpeng CPU lines are marketed by Huawei.

Source: company website · checked

Profile checked www.hisilicon.com/en
Listing
PrivateNot listed
Headquarters
ShenzhenMainland China
Segment peers
9cos.Compute (CPU / GPU / AI)
Next report
—No confirmed date
Export controls
Entity Listsince 2019

Position in the supply chain

Compute (CPU / GPU / AI) · 9 companies

Design tools · 3
EDA & IP
3cos.
Equipment & materials · 26
Equipment
17cos.
 Materials
9cos.
Chipmakers · 30
Foundry
8cos.
 Memory
14cos.
 Analog & Power
8cos.
Chip designers · 20
Compute
9cos.
 Fabless SoC & RF
11cos.
Packaging & test · 4
Packaging & Test
4cos.

ChipCorridor classification: one segment per company. CPUs, GPUs, AI accelerators and automotive AI SoCs.

Compute (CPU / GPU / AI): all 9

■ = on the US Entity List

Events

export controls, listings, earnings

  1. Entity ListHuawei added to the Entity List

Export controls

US Entity List / VEU, as of 2026-10-18

  • Entity List ·
    Listed as: Huawei Technologies Co., Ltd. (and 68 non-US affiliates)
    Rule details

Key facts

Full name
HiSilicon (Huawei) 海思
Listing(s)
Not listedTo verifyNo stock-exchange listing found for this company as of the check date (to verify).
Headquarters
Shenzhen深圳 Source: hisilicon.com · checked
Segment
Compute (CPU / GPU / AI) (ChipCorridor classification)
Website
www.hisilicon.com/en

Profile last checked (UTC+8). Content last changed .