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Winbond Electronics华邦电子

2344.TW TWSE Memory Taichung, Taiwan

Specialty memory IDM: specialty DRAM, mobile DRAM and code-storage flash (NOR, SLC NAND).

Source: company website · checked

Profile checked www.winbond.com
Listing
2344.TWTWSE
Headquarters
TaichungTaiwan
Segment peers
14cos.Memory
Next report
—No confirmed date
Export controls
None tracked2019–2026

Position in the supply chain

Memory · 14 companies

Design tools · 3
EDA & IP
3cos.
Equipment & materials · 26
Equipment
17cos.
 Materials
9cos.
Chipmakers · 30
Foundry
8cos.
 Memory
14cos.
 Analog & Power
8cos.
Chip designers · 20
Compute
9cos.
 Fabless SoC & RF
11cos.
Packaging & test · 4
Packaging & Test
4cos.

ChipCorridor classification: one segment per company. DRAM, HBM, NAND/NOR flash, memory interface chips and storage products.

Memory: all 14

■ = on the US Entity List

Events

export controls, listings, earnings

No dated events in our dataset yet.

Export controls

US Entity List / VEU, as of 2026-10-18

No US Entity List or VEU action naming this company in our dataset as of 2026-10-18. Our dataset is not a complete legal screening; check the official BIS lists.

Key facts

Full name
Winbond Electronics 华邦电子
Listing(s)
2344.TW · TWSE Source: isin.twse.com.tw · checked
Headquarters
Taichung台中 Source: winbond.com · checked
Segment
Memory (ChipCorridor classification)
Website
www.winbond.com

Profile last checked (UTC+8). Content last changed .