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Tongfu Microelectronics通富微电

002156.SZ SZSE Packaging & Test (OSAT) Nantong, Mainland China

OSAT provider with advanced packaging for CPUs/GPUs, including a long-running partnership with AMD.

Source: company website · checked

Profile checked www.tfme.com
Listing
002156.SZSZSE
Headquarters
NantongMainland China
Segment peers
4cos.Packaging & Test (OSAT)
Next report
—No confirmed date
Export controls
None tracked2019–2026

Position in the supply chain

Packaging & Test (OSAT) · 4 companies

Design tools · 3
EDA & IP
3cos.
Equipment & materials · 26
Equipment
17cos.
 Materials
9cos.
Chipmakers · 30
Foundry
8cos.
 Memory
14cos.
 Analog & Power
8cos.
Chip designers · 20
Compute
9cos.
 Fabless SoC & RF
11cos.
Packaging & test · 4
Packaging & Test
4cos.

ChipCorridor classification: one segment per company. Outsourced assembly and test, including advanced packaging.

Packaging & Test (OSAT): all 4

■ = on the US Entity List

Events

export controls, listings, earnings

No dated events in our dataset yet.

Export controls

US Entity List / VEU, as of 2026-10-18

No US Entity List or VEU action naming this company in our dataset as of 2026-10-18. Our dataset is not a complete legal screening; check the official BIS lists.

Key facts

Full name
Tongfu Microelectronics 通富微电
Listing(s)
002156.SZ · SZSE Source: tfme.com · checked
Headquarters
Nantong南通 Source: tfme.com · checked
Segment
Packaging & Test (OSAT) (ChipCorridor classification)
Website
www.tfme.com

Profile last checked (UTC+8). Content last changed .