MediaTek联发科
Fabless SoC designer for smartphones (Dimensity), smart TVs, Wi-Fi, automotive and custom ASICs.
Source: company website · checked
Profile checked www.mediatek.com
- Listing
- 2454.TWTWSE
- Headquarters
- HsinchuTaiwan
- Segment peers
- 11cos.Fabless SoC & RF
- Next report
- 30 Octin 12dQ3 2026 · Scheduled · confirmed
- Export controls
- None tracked2019–2026
Position in the supply chain
Fabless SoC & RF · 11 companies
Design tools · 3
Equipment & materials · 26
Chipmakers · 30
Chip designers · 20
Packaging & test · 4
ChipCorridor classification: one segment per company. Application processors, connectivity, RF front-end, sensors and security chips.
Fabless SoC & RF: all 11
■ = on the US Entity List
Events
export controls, listings, earnings
- EarningsQ3 2026 report Scheduled · confirmed
Export controls
US Entity List / VEU, as of 2026-10-18
No US Entity List or VEU action naming this company in our dataset as of 2026-10-18. Our dataset is not a complete legal screening; check the official BIS lists.
Key facts
- Full name
- MediaTek 联发科
- Listing(s)
- Headquarters
- Hsinchu新竹 Source: mediatek.com · checked
- Segment
- Fabless SoC & RF (ChipCorridor classification)
- Website
- www.mediatek.com
- Next report
- Scheduled · confirmedSource: MediaTek conference-call invitation (16 Oct 2026)
Profile last checked (UTC+8). Content last changed .